OTemp
Optical Thermal Effect Modeling Platform
Thermal sensitivity is a key characteristic and potential issue of photonic devices used by optical interconnect networks, such as in-rack optical interconnect and inter/intra-chip optical networks. We developed OTemp (Optical Thermal Effect Modeling Platform) to systematically model and analyze the performance of optical interconnects under temperature variations. OTemp is open-source and implemented in C++.
OTemp models the thermal effects at photonic device level. It can analyze arbitrary optical interconnects using either a single wavelength or multiple wavelengths such as WDM. OTemp can perform both worst-case and average-case analysis. The following diagram is an overview of OTemp.
Project Member: Shixi Chen, Jiang Xu, Xuanqi Chen, Jiaxu Zhang, Zhongyuan Tian, Jun Feng, Xiao Li
Maintained by: Shixi Chen (schenax@connect.ust.hk). If there is any inquiry or suggestion, please do not hesitate to contact us.
Past Member: Yaoyao Ye, Zhehui Wang, Zhifei Wang, Peng Yang, Mahdi Nikdast, Xiaowen Wu, Luan H.K. Duong
Download User Manual
Or you can download the full package directly.
Download OTemp 2.0
AGREEMENT
OTemp is made openly available under the following license. Please cite the following paper if it is used.
- Yaoyao Ye, Jiang Xu, Xiaowen Wu, Wei Zhang, Xuan Wang, Mahdi Nikdast, Zhehui Wang, Weichen Liu, “System-Level Modeling and Analysis of Thermal Effects in Optical Networks-on-Chip”, IEEE Transactions on Very Large Scale Integration Systems, vol. 21, no. 2, pp. 292-305, February 2013. [PDF]
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